Zazzabi na atomatik da sarrafa zafi

Zazzabi da zafi na ɗakin mai tsabta an ƙaddara shi ne bisa ga tsarin da ake buƙata, amma a ƙarƙashin yanayin da ake bukata na tsari, ya kamata a yi la'akari da jin daɗin ɗan adam.Tare da karuwar buƙatun tsabtace iska, akwai yanayin cewa tsarin yana da ƙarin buƙatu masu tsauri akan zafin jiki da zafi.

Yayin da daidaiton mashin ɗin ke ƙara ƙaranci, abubuwan buƙatu na kewayon canjin zafin jiki suna ƙara ƙarami.Misali, a cikin tsarin bayyanar lithography na samar da keɓaɓɓiyar haɗaɗɗun keɓaɓɓiyar keɓancewar yanayi, bambanci tsakanin madaidaicin haɓakar zafin jiki na gilashi da wafer silicon kamar yadda ake buƙatar kayan diaphragm don ƙarami da ƙarami.Wafer silicon tare da diamita na 100μm zai haifar da faɗaɗa madaidaiciyar 0.24μm lokacin da zafin jiki ya tashi da digiri 1.Saboda haka, dole ne ya kasance yana da yawan zafin jiki na ± 0.1 digiri.A lokaci guda kuma, ana buƙatar ƙimar zafi gabaɗaya don ƙasa, saboda bayan mutum ya yi gumi, samfurin zai ƙazantar da shi, musamman Ga semiconductor bitar da ke tsoron sodium, irin wannan tsaftataccen bita bai kamata ya wuce digiri 25 ba.

Yawan zafi yana haifar da ƙarin matsaloli.Lokacin da danƙon dangi ya wuce 55%, ƙazanta zai faru akan bangon bututun ruwan sanyaya.Idan ya faru a cikin na'ura mai mahimmanci ko da'ira, zai haifar da haɗari daban-daban.Yana da sauƙi don tsatsa lokacin da dangi zafi shine 50%.Bugu da ƙari, lokacin da zafi ya yi yawa, ƙurar da ke saman ma'aunin siliki za a yi amfani da su ta hanyar sinadarai ta hanyar kwayoyin ruwa da ke cikin iska zuwa saman, wanda ke da wuyar cirewa.Mafi girman yanayin zafi na dangi, yana da wahala don cire mannewa, amma lokacin da yanayin zafi ya kasance ƙasa da 30%, ƙwayoyin kuma ana iya tallata su cikin sauƙi a saman saboda aikin ƙarfin lantarki, da adadi mai yawa na semiconductor. na'urori suna da saurin lalacewa.Mafi kyawun kewayon zafin jiki don samar da wafer silicon shine 35 ~ 45%.